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Products & Technology : WaveProcessor TM Interleaver

Telecommunications Component Award
The 2000 Photonics Circle of Excellence Award Winner

One of Five Passive Telecommunications Component Winners




WaveProcessor F3T Interleaver Contents:


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Read articles about the WaveProcessor.

Features & Benefits

  • Low insertion loss
  • Low dispersion
  • Low crosstalk
  • Excellent flat-top passband performance
  • Customized platform available
  • All-fiber design


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    Applications

  • Interleaving of dense channel spacings
  • Multichannel optical add/drop multiplexing in networks
  • Modular expansion for capacity upgrade


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    Product Capabilities and Value

    With the growing need for bandwidth, system designers are packing as many channels as possible into their DWDM systems. Their design goals place increasingly stringent demands on all the filtering components used in the system, demands such as very low insertion loss, wide channel passband, and low crosstalk.

    WaveSplitter was one of the first to bring an interleaving product to market with its WaveProcessor F³T Interleaver, addressing the need for more bandwidth by interleaving multiple sets of optical channels into a single, densely packed stream. This enables higher bandwidth in existing networks and allows network upgrades and developments such as the introduction of ultrahigh transmission speeds in long-haul systems.

    The WaveProcessor's design is based on an all-fiber flat-top channel response, which enables low insertion and polarization-dependent loss, low dispersion and high channel isolation over a passband greater than 50 percent of the channel spacing. A flat-top interleaver allows for drift in system laser sources without significant degradation in signal transmission performance. This approach is designed to give telecommunications systems developers and integrators a high degree of flexibility and scalability in meeting existing and future bandwidth capacity requirements. Its active-temperature control design provides enhanced center wavelength accuracy over an operating temperature range of 0 to 65 °C, which is especially important as the channel spacing is reduced.

    In addition to the above application, the F³T Interleaver can be used for multichannel optical add/drop multiplexing in networks. The low dispersion performance of the WaveProcessor is especially important in all-optical networks where the signal passes through multiple components without regeneration.

    Finally, the WaveProcessor Interleaver was recently awarded the Photonics Circle of Excellence Award, which recognizes the 25 most technically innovative new products of the year. WaveSplitter's WaveProcessor Interleaver was included as one of only five passive components designed for advanced telecommunications networks.

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    Figure 1: Specifications

    Performance Specifications for WaveProcessor F3T Interleaver
    Parameters Multiplexer Demultiplexer
    Channel Spacing 50 GHz 50 GHz
    Maximum Channel Count 80 channels 80 channels
    Wavelength Range (nm) 1500-1610 1500-1610
    Insertion Loss (dB) 1.0 2.0
    Insertion Loss Uniformity (dB) < + 0.25 < + 0.50
    Ripple (dB) 0.5 0.5
    0.5 dB Bandwidth (GHz) + 13 + 11
    1.0 dB Bandwidth (GHz) + 16 + 13
    3.0 dB Bandwidth (GHz) + 22 + 18
    Optical Return Loss (dB) > 45 > 45
    PDL (dB) < 0.3 < 0.3
    Dispersion (ps/nm) < 40 (at + 10 GHz) < 10 (at + 10 GHz)
    Channel Crosstalk (dB) 12 (at + 10 GHz) 22 (at + 10 GHz)
    Storage Temperature (°C) -40 to 70 -40 to 70
    Operating Temperature (°C) 0 to 65 0 to 65
    Module Warm-up Time (at 23° C) 10 minutes 10 minutes
    Heater Power Consumption (steady state) ~6W @ 0° C ~6W @ 0° C
    Heater Power Consumption (Max) ~9W ~9W
    Package Size¹ (cm) 15.0 x 7.7 x 2.9 15.0 x 7.7 x 2.9
    Insertion loss, crosstalk and PDL are measured at the ITU
    grid wavelengths.
    ¹ - Standard pigtail length = 100 (+ 10) cm
    Note: All data taken prior to connectorization
    US patent no. 5,809,190
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    Figure 2: Spectral Performance

    Spectral Performance


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    Figure 3: Application Schematic

    Application Schematic


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